ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with square substrates, which promises to increase the company's advanced ...

TSMC, Micron, and ASE are working on getting deals to secure old display panel plants in Taiwan, and convert them to CoWoS advanced semiconductor packaging facilities to meet the unstoppable AI GPU ...

IC backend house ASE Technology Holding's newly-developed fan-out panel-level packaging (FOPLP) technology has obtained orders from HiSilicon, according to sources familiar with the matter. Save my ...

BAYAN LEPAS, Malaysia--(BUSINESS WIRE)-- ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan ...

TAIPEI (Taiwan News) — Advanced Semiconductor Engineering Inc. (ASE) CEO Wu Tien-yu (吳田玉) announced Tuesday that the company plans to establish Taiwan’s first large-scale 600x600 fan-out panel-level ...

Earnings Call Insights: ASE Technology Holding Co., Ltd. (NYSE:ASX) Q4 2024 Consolidated revenues grew 2% year-over-year in 2024, with ATM revenues increasing 3%. Advanced packaging and testing ...

(MENAFN- GlobeNewsWire - Nasdaq) Panel Level Packaging Market growth is driven by miniaturization in electronics, 5G and AI demand, cost efficiency, and adoption in automotive and consumer devices.

Taiwanese test, assembly and packaging house Advanced Semiconductor Engineering Inc. (ASE) today reported that its consolidated revenues for May were $121 million (4.2 billion Taiwanese dollars), a ...

SANTA CLARA, Calif. — Officials with Taiwanese IC-packaging and test giant Advanced Semiconductor Engineering Inc. (ASE) here outlined a bold strategy to enter the China market, telling SBN that the ...

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX) today officially launched its fifth plant in Penang, Malaysia. The new plant will ...