Nasdaq

Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications

MOUNTAIN VIEW, Calif., Oct. 22, 2020 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5 ...
Design-Reuse

IC Compiler II with Advanced Fusion Technologies Delivers Optimal QoR and Reduces ECO Turnaround Time More Than 40% at Juniper Networks

MOUNTAIN VIEW, California -- June 12, 2019 -- S ynopsys, Inc. (Nasdaq: SNPS) today announced that its innovative IC Compiler ™ II place-and-route solution with Advanced Fusion technologies has been ...
Semiconductor Engineering

Accelerating Toshiba’s Advanced System-on-Chip (SoC) Design with Synopsys’ Fusion Compiler

How Toshiba used early access to an RTL-to-GDSII solution to shorten design time of an advanced, automotive SoC. Authors: Mitchy M. Mitsuyasu, Senior Specialist, Semiconductor R&D, Toshiba Electronic ...