EDN

Infineon, AMD, UMC ally to develop advanced 300mm-wafer process

Infineon Technologies A.G. has joined Advanced Micro Devices Inc. (AMD) and United Microelectronics Corp. (UMC) in a bid to develop one of the industry's most advanced manufacturing platform ...
CNET

Pact focuses on shrinking chip parts

Chipmakers Advanced Micro Devices and Infineon, together with foundry United Microelectronics Corp., are collaborating to create faster, cooler and more power-saving processors expected to be at the ...
EDN

Infineon ramps 0.14-micron DRAM process

LONDON — Infineon Technologies AG (Munich, Germany) has begun sampling 512-Mbit DRAMs and is manufacturing production volumes of 256-Mbit synchronous DRAMs in a 0.14-micron process technology at its ...
Nasdaq

Infineon Unveils 300 Mm Power Gallium Nitride Wafer Technology

(RTTNews) - German semiconductor maker Infineon Technologies AG (IFNNY) announced Wednesday the development of the world's first 300 mm power gallium nitride or GaN wafer technology. The ...
Digi Times

Infineon unveils ultra-thin 20-micrometer power semiconductor wafer

Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer and the inauguration ...
Seeking Alpha

Infineon pioneers world's first 300 mm power gallium nitride (GaN) technology - an industry game-changer

Infineon Technologies AG (FSE: IFX) (OTCQX: IFNNY) today announced that the company has succeeded in developing the world's first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the ...
RFID Journal

German Semiconductor Maker Tracks Production With RFID, Ultrasound

Infineon Technologies, a producer of semiconductors, is using radio frequency identification combined with ultrasound-based location-tracking technology to continuously oversee and better manage its ...
Electronic Design

STMicroelectronics, STATS ChipPAC, And Infineon Join Forces On Wafer-Level-Packaging

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
SDxCentral

Infineon unveils world’s thinnest silicon power wafers

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...
Electronic Design

Modified IC Process Grows Carbon Nanotubes On 6-in. Wafers

A crucial breakthrough has been achieved by Infineon Technologies, Munich, Germany, for growing carbon nanotubes (CNTs) on 6-in. silicon wafers. The modified CVD ...
TechSpot

Infineon unveils world's thinnest silicon wafer for AI data centers, measuring just 20 micrometers

The big picture: Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant ...