The intelligence community (IC) published its first-ever open-source intelligence (OSINT) strategy in March. It is a big-picture, priority setting document—an essential, basic step to re-launch OSINT ...

As many of you may have seen, we’ve passed a major milestone since Siemens announced its intent to acquire Mentor Graphics four years ago. As of January 1, 2021, “Mentor, a Siemens business” has ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

ST. PAUL, Minn.--(BUSINESS WIRE)--IC System is proud to announce that CFO and Executive Vice President Kurt Heinbigner has been awarded Outstanding Financial Executive in the Twin Cities by ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

Microchip Technology has claimed the industry’s first single-chip, four-channel I 2 C thermocouple conditioning IC to deliver up to ±1.5°C accuracy with the introduction of the MCP9604 integrated ...